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ECARX signs non-binding MoU with Arm to develop next-gen AI computing platforms
ECXECARX Holdings Inc.
ECARX Holdings Inc. and Arm have signed a non-binding Memorandum of Understanding (MoU) to jointly explore and develop next-generation high-performance AI computing platforms for mobility and broader cross-industry applications. The agreement establishes a framework for advanced solution development, including joint research and development and product definition. Under the MoU, the partners will advance co-engineering activities spanning system-level architecture, performance optimization, software enablement, functional safety, toolchain and cybersecurity validation, as well as ecosystem build-out. They will also explore tailored configurations optimized for deployment across China and global markets. This collaboration builds on a longstanding relationship, including through SiEngine, which has delivered millions of units of its 7nm SE1000 platform automotive-grade SoCs since March 2023. Development of the next-generation 5nm SE2000 SoC platform is also underway. ECARX Holdings Inc. operates in the automotive intelligence industry, providing end-to-end full-stack solutions for software-defined and AI-defined vehicles.