Financing ·
On August 26, 2026, United Microelectronics Corporation's Board of Directors resolved to issue up to US$1.8 billion in…
UMCUnited Microelectronics Corp
On August 26, 2026, United Microelectronics Corporation's Board of Directors resolved to issue up to US$1.8 billion in 7th Unsecured Overseas Convertible Bonds. Each bond has a face value of US$200,000 and is tentatively priced at 100% with a 0% coupon rate. The proceeds will be used for purchasing machinery, equipment, and facilities. The issuance includes Tranche A and Tranche B, with the Chairman authorized to determine final terms based on market conditions. This financing activity is material as it involves significant capital raising that may impact equity dilution upon conversion. United Microelectronics Corporation operates in the semiconductor industry, specifically providing integrated circuit foundry services.